Pular para o conteúdo principal
Knowledgebase
Home
Renesas Brasil - Knowledgebase

What is thermal resistance of each package in H8/Tiny series?

Latest Updated:03/26/2009

Question:

What is thermal resistance of each package in H8/Tiny series?

Answer:

Each package of θjc, the junction to case thermal resistance(not mounted on board), θja, the junction to ambient thermal resistance(mounted on board), and the junction to case thermal resistance, are as follows. Because thermal resistance varies depending on the lead frame material and die size, the data must be handled taking the test conditions into consideration.Please refer to the package data book.

Package code
θja(℃/W)
Not mounted on board
θja(℃/W)
Mounted on board
θjc(℃/W)
FP-80A
115
99
25
FP-64A
118
103
34
FP-64E
161
98
21
FP-48B
172
98
24
FP-48F
161
98
21
TNP-48
297
144
16
FP-32A
172
98
3
FP-32D
-
66
19
DP-32S
-
66
-


In addition, RENESAS does not guarantee these parameters. Please use these values only for your reference.
Suitable Products
H8/300H Tiny
H8/36109
H8/36087
H8/36077, H8/36079
H8/36064
H8/36049
H8/36037, H8/36057
H8/36014, H8/36024
H8/3694
H8/3687
H8/3672
H8/3664
H8/36912, H8/36902